Integrated HBM controller and HBM PHY subsystem solution supporting HBM2 and HBM2E JEDEC spec for a wide range of technology and foundry nodes. As an early advocate of 2.5D and 3D ASIC design technologies and by leveraging its experience from the industry’s first multiple successful 2.5D SoC SiP demonstration, SiFive plays a key role in enabling industry applications that leverage the HBM 3D-stacked DRAM technology.
Best-in class SoC IPs covering wide range of applications from IoT devices, networking and AI/HPC
Interlaken IP Subsystem
Interlaken IP is used by applications including NPU, traffic management and switch fabrics. OpenFive supports silicon-proven Interlaken IP with over 75+ tier 1 customers on various technology and process nodes.
Ethernet IP Subsystem
Comprehensive portfolio of fully configurable multi-channel, multi-rate Ethernet MAC, PCS and FEC IP. Support for OIF FlexE in addition to IEEE802.3 standard for data center applications.
USB IP Subsystem
Full range of USB controllers supporting USB2.0/USB3.0/USB3.1 gen1 and gen2 in device mode of operation. Supports AXI interface and in-built DMA features.
Die-to-Die IP Subsystem
Die-to-Die Controller IP offers unique value proposition in terms of low power, high throughput and low latency links enabling faster time to integration for heterogenous chiplet connections in wired communications, AI and HPC applications.